Some experimental studies on silicon wafer grinding. Studies on wafer rotation grinding method. 1st Report.
نویسندگان
چکیده
منابع مشابه
Investigations of silicon wafer grinding using finite element analysis
Silicon wafers are used as substrates to build more than 90% of integrated circuits. One of the manufacturing processes for silicon wafers is grinding. This paper reports the investigations of silicon wafer grinding using Finite Element Analysis (FEA). FEA models are first used to study the effects of process parameters on waviness reduction in the grinding of wire-sawn wafers on a rigid chuck....
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plicated processes on the wheel surf ace along the wheel width. In order to make these processes clear, the experimental analysis of traverse grinding was conducted by widely changing the speed ratio, Kv, the setting depth of wheel, ‡TMT, and the number of total steps, m, (the ratio of the wheel width over the traverse feed per one revolution of the workpiece). The following results were obtain...
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Three-dimensional IC (3D IC) exhibits various advantages over traditional two-dimensional IC (2D IC), including heterogeneous integration, reduced delay and power dissipation, smaller chip area, etc. Wafer-on-wafer stacking is most attractive for 3D IC fabrication, but it suffers from low compound yield. To improve the compound yield, two efforts have been done in this work. First, a hybrid waf...
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Wafers prepared by an HF dip without a subsequent water rinse were bonded at room temperature and annealed at temperatures up to 1100 “C. Based on substantial differences between bonded hydrophilic and hydrophobic Si wafer pairs in the changes of the interface energy with respect to temperature, secondary ion mass spectrometry (SIMS) and transmission electron microscopy (TEM), we suggest that h...
متن کاملFundamental Study on Cross Axis Grinding Method
In this study, it is experimentally investigated that the surface generation process in the cross axis grinding method with small diameter grinding wheel. In this grinding method, workpiece surface speed and sum of both wheel working surface speed and wheel feed rate crossed each other. Therefore, it is the largest characteristic that the cross angle, which is defined as the angle between the w...
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ژورنال
عنوان ژورنال: Journal of the Japan Society for Precision Engineering
سال: 1987
ISSN: 1882-675X,0912-0289
DOI: 10.2493/jjspe.53.438